Features
- Standard in-line filter prevents nozzle clogging.
- Platinum sensors provide optimum temperature control.
- Standard air open/air close module for accurate bead placement.
- Low-Profile design ideal for case erecting and case sealing applications.
- Rotating right angle nozzles can be positioned for optimum pattern placement.
The Dynatec Difference
Air Open/Air Close Design
Over time, adhesive applicator modules that use an air open/spring close system can lose spring tension, resulting in stringing and poor cut-offs. The LP Mod-Plus Marathon™ applicator module is designed to operate as an air open/air close system that does not rely on a spring to close the orifice during operation. The result is both cleaner cut-off and better operation over a longer operating lifespan. While this feature may be optional on competitive modules, only ITW Dynatec offers this feature standard on the LP Mod-Plus Marathon™ adhesive applicator.